As artificial intelligence clusters grow, moving data efficiently is becoming as critical as processing it. On September 21, 2026, ams OSRAM announced a breakthrough in optical interconnect technology aimed at addressing this challenge: a next-generation 850 nm Thin-Film VCSEL platform for AI scale-up networks, along with a connectorized multi-core fiber demonstrator developed with ecosystem partner BizLink. The company is expanding its Digital Photonics strategy into AI infrastructure, leveraging its expertise in intelligent light emitters and semiconductor manufacturing.
The new microVCSEL platform combines top-emission Thin-Film VCSELs, dense 25 µm pitch microVCSEL arrays with addressability, silicon TSV integration, and compatibility with standard multimode fiber. The company reported error-free 32 Gb/s NRZ operation with an energy efficiency of approximately 0.25 pJ/bit—a level that could significantly reduce power consumption in data centers. Reliability testing showed no failures after more than 2,000 hours under elevated junction temperatures and current overstress. These results suggest a path toward highly parallel “wide-and-slow” optical architectures that distribute data across many lower-speed lanes instead of a few complex channels, reducing system complexity and latency.
At ECOC 2026 in Malaga, ams OSRAM and BizLink will demonstrate a connectorized multi-core fiber solution in a private setting for selected customers. This collaboration combines ams OSRAM’s 2D addressable 850 nm microVCSEL arrays with BizLink’s fiber-array integration and optical packaging expertise. “This demonstrator validates a fundamentally different optical interconnect architecture optimized for ultra-low power and low latency operation,” said Hendrik Coldenstrodt, CTO of BizLink Group’s Computing and Transportation Business Group. Ashkan Seyedi, Vice President and General Manager of Optical Interconnects at ams OSRAM, added that the partnership aims to build a scalable industry solution.
The implications for the AI industry are substantial. As AI training and inference clusters scale, intra-datacenter connectivity demands higher bandwidth, lower latency, and better power efficiency. ams OSRAM’s wide-and-slow approach could offer a more sustainable and cost-efficient alternative to traditional interconnects. The technology builds on the same platform that enabled EVIYOS™, a digital lighting solution for adaptive headlamps, demonstrating the scalability and manufacturability of ams OSRAM’s photonics platform. The company is also developing fully integrated 3D photonics stacks combining microVCSEL arrays, micro-photodiode arrays, and mixed-signal CMOS electronics. For more details on ams OSRAM’s optical interconnect technology, visit their technology page or the company’s website at https://ams-osram.com. The company also maintains a presence on LinkedIn and YouTube. The original release is available at www.newmediawire.com.
