BeSang Announces Breakthrough TRUE 4F2 DRAM Technology Overcoming Industry Scaling Limits
October 14th, 2025 7:00 AM
By: Advos Staff Reporter
BeSang has developed TRUE 4F2 DRAM technology that overcomes decades of industry barriers, enabling higher density, efficiency and cost savings while reducing dependence on high-stack HBM for AI applications.

BeSang has announced a significant breakthrough with the introduction of TRUE 4F2 DRAM technology, successfully overcoming the scaling limitations that have constrained conventional 6F2 DRAM for decades. This development represents a major advancement in semiconductor memory technology that has long been considered an industry goal but never achieved in practical market applications.
For years, 4F2 DRAM has remained elusive due to technical barriers in structure and processing that caused proposed designs to result in cells significantly larger than the targeted 4F2 size. BeSang's proprietary TRUE 4F2 DRAM technology now delivers an effective 4F2 cell, unlocking unprecedented levels of density, efficiency, speed, and cost savings that could transform memory technology across multiple industries.
Chris Lee, Chief Operating Officer of BeSang, stated that 4F2 DRAM has long been considered hype and myth within the industry without practical implementation. He emphasized that BeSang's TRUE 4F2 DRAM technologies are expected to defy the 6F2 DRAM cell scaling limitation and provide incredibly low-cost solutions for stand-alone DRAM products. The technology would also enable ultra high-density embedded L3 cache memories for GPU, CPU, and AP applications, potentially boosting system performance dramatically while reducing dependence on high-stack HBM for artificial intelligence systems.
The TRUE 4F2 DRAM technology is designed for versatility, supporting traditional 2D ICs, monolithic 3D ICs, and package level 3D ICs. This flexibility enables both stand-alone and embedded applications, making the technology adaptable to various computing architectures and system requirements. The breakthrough comes at a critical time when AI and high-performance computing applications are demanding increasingly dense and efficient memory solutions.
This advancement sets a new standard for cost-efficient, high-density, high-performance memory and signals a transformative leap forward for the semiconductor industry. The technology could have far-reaching implications for data centers, consumer electronics, automotive systems, and AI infrastructure by providing more efficient memory solutions that reduce power consumption while increasing performance. For more information about BeSang's technology developments, visit https://www.besang.com.
Source Statement
This news article relied primarily on a press release disributed by 24-7 Press Release. You can read the source press release here,
