Eliyan Achieves Breakthrough in Chiplet Interconnect Technology with 64Gbps PHY in 3nm Process

Eliyan Corporation has announced a major breakthrough in chiplet interconnect technology with the successful delivery of first silicon for its NuLink™-2.0 PHY, manufactured in a 3nm process. The new device achieves an industry-leading performance of 64Gbps per bump, effectively doubling the bandwidth for die-to-die connectivity in multi-die architectures.

This achievement marks a significant milestone in semiconductor technology, as it addresses a fundamental challenge in scaling semiconductor performance, size, power, and cost. The NuLink™-2.0 PHY is compatible with the UCIe standard while offering 2x higher bandwidth on both standard and advanced packaging. This advancement comes with unprecedented improvements in power consumption, area efficiency, and latency.

The implications of this technology are far-reaching across multiple industries. In artificial intelligence, high-performance computing, and gaming, the NuLink-2.0 PHY can significantly enhance Die-to-Memory bandwidth by over 2x using UMI technology. This improvement could lead to more powerful and efficient systems in these rapidly growing sectors.

Moreover, the solution's ability to enable high-performance multi-die architectures at lower power and costs makes it suitable for a wide range of markets, including aerospace, automotive, and industrial applications. This versatility could accelerate innovation and product development across these sectors.

From a sustainability perspective, Eliyan's technology offers significant benefits. By reducing power consumption and manufacturing waste while improving performance, it addresses the growing concern of energy efficiency in the tech industry. This aligns with the increasing focus on sustainable practices in semiconductor manufacturing and electronic device design.

The semiconductor industry has been facing challenges in maintaining Moore's Law, which predicts the doubling of transistor density every two years. Eliyan's breakthrough in chiplet technology provides a potential pathway to continue performance improvements while managing costs and power consumption, potentially extending the life of Moore's Law.

As the demand for more powerful and efficient computing solutions continues to grow, particularly in data centers, edge computing, and AI applications, Eliyan's NuLink™-2.0 PHY could play a crucial role in shaping the future of semiconductor design and manufacturing. Its ability to deliver high performance while addressing key industry challenges positions it as a technology to watch in the coming years.